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BAE Systems Microelectronics Packaging Director in Cedar Rapids, Iowa

Job Description

BAE Systems is looking for a Microelectronics Packaging Director. This position can be located at any of our major locations within the Electronic Systems sector.

You don t see it, but it s there. Our employees work on the world s most advanced electronics from saving emissions in the City of Lights to powering the Mars Rover to protecting the F-35 fighter jet. At Electronic Systems, you ll be among the brightest minds, working on the aerospace and defense industry s most difficult problems. Drawing strength from our differences, we re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first exemplified by our missions: We Protect Those Who Protect Usand We Innovate For Those Who Move The World TM . Sound like a team you want to be a part of? Come build your career with BAE Systems.

Responsibilities for our Microelectronics Packaging Director include:

  • Direct digital, mixed signal, and millimeter wave IC packaging activities and staffing for program tasks totaling $15M per year

  • Primary contact with product line leadership to ensure program execution

  • Define strategic IC packaging capability plans and roadmaps by collecting inputs from internal/external SMEs

  • Defines and/or establishes IC packaging design and fabrication processes consistent with company-wide policies and procedures

  • Develops operating budgets, schedules, and performance standards in support of packaging design financial and staff planning

  • Coordinate external packaging services

Required Education, Experience, & Skills

  • Bachelor's degree and minimum of 12 years of experience

  • Active Secret Clearance with the ability to obtain a TS/SCI clearance

  • Proven record of leading multiple IC packaging teams including analog, RF, millimeter-wave, digital, MCMs, MCPs, SiPs, and SoCs with 10 staff geared toward RF military electronics and leveraging commercial technologies

  • Demonstrated ability to successfully plan/manage/execute large EMD and production programs in excess of $15M

  • Strong communication and collaboration skills

  • Ability and desire to mentor early through late career team members

Preferred Education, Experience, & Skills

TS/SCI clearance

Microelectronics Packaging Director

66767BR

EEO Career Site Equal Opportunity Employer. Minorities . females . veterans . individuals with disabilities . sexual orientation . gender identity . gender expression

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